Silicon wafers, substrates and sample supports


    Si-wafer-2
   Si wafers: 51mm, 100mm and 150mm diameter
   Diced silicon wafer for EM
   Diced silicon wafer

Introduction

Polished silicon is an excellent substrate for imaging, experiments, nanotechnology and micro-fabrication applications.  It is available in the form of wafers, diced wafer or as smaller chips (pieces). The silicon wafer and chips all have a <100> orientation. Cleaving of the wafers to the desired size with a <100> orientation wafers is straight forward and simple. The silicon wafers and chips are all P-type, doped with B to provide excellent conductivity for SEM, FIB and STM applications.
For biological applications silicon resembles glass, which makes it a suitable support for growing and/or mounting cells. For imaging applications, it is an ideal sample substrate for small particles due to the low background signal of the highly polished surface.
Two grades of silicon substrates are offered:

  • Micro-Tec standard silicon wafers and silicon chips for standard application and medium resolution imaging.
  • Nano-Tec ultra-flat silicon wafers and ultra-flat silicon chips for demanding applications and high resolution imaging.

Micro-Tec <P/100> standard silicon wafers and diced wafer for SEM substrates

The Micro-Tec <P/100>  silicon wafer substrates can be used for sample substrates, micro-fabrication, substrate for thin film research or biological substrates. Useful flat substrate for SEM imaging of particles due to the low background. For biological applications, Si has similar properties as glass and can be used to mount or grow cells. Can be easily cleaved or used as a whole wafer. The Micro-Tec Si wafers are packed in a wafer carrier tray for protection. The 100mm diced wafers are supplied on wafer adhesive disc and packed between two plastic sheets for protection. The Si chips can be easily lifted off the adhesive sheet. Sizes of the Si chips are 5 x 5 mm, 7.5 x 7.5 mm and 10 x 10 mm. De Si chips can be easily fitted to SEM stubs.
The Micro-Tec standard silicon wafer substrates are available as:

Specifications of the Micro-Tec <P/100> standard silicon wafers and chips:

Parameter

Ø2”/51mm wafer

Ø4”/100mm wafer

Ø6”/150mm wafer

Diced Ø4”/100mm

Diced Ø4”/100mm

Diced Ø4”/100mm

Product #

10-008120

10-008140

10-008160

10-008145

10-008147

10-008149

Orientation

<100>

Type

P (Boron) with one primary flat

Resistivity

1-30 Ohm/cm

Coating

None, native oxide only

Thickness

275µm (+/- 20µm)

525µm (+/- 20µm)

675µm (+/- 20µm)

525µm (+/- 20µm)

525µm (+/- 20µm)

525µm (+/- 20µm)

Diameter

51mm

100mm

150mm

100mm

100mm

100mm

Chip (die) size

n.a.

n.a.

n.a.

5x5mm

7.5x7.5mm

10x10mm

Chip quantity

n.a.

n.a.

n.a.

 ~270

  ~112

  ~55

TTV

≤ 20µm

Primary flat

15.9 +/- 1.65mm

32.5 +/- 2.5mm

57.5 +/- 2.5mm

32.5 +/- 2.5mm

32.5 +/- 2.5mm

32.5 +/- 2.5mm

Surface roughness

<1.5nm, polished on one side

 

Nano-Tec ultra-flat <P/100> silicon wafers and ultra-flat silicon chips

The Nano-Tec, ultra-flat P<100> silicon wafers have higher specifications than the Micro-Tec silicon wafers. They are preferred for demanding applications in micro-fabrication, as substrates for thin film research or biological substrates. Excellent ultra-flat surface for high resolution SEM imaging of particles due to the low background signal. For biological applications, Si has similar properties as glass and can be used to mount or grow cells. The larger wafers with the <100> orientation can be easily cleaved to the desired size. The ultra-flat Nano-Tec Si wafers are clean-room packed in a wafer carrier tray for protection. The ultra-flat Si chips are precision diced with a dicing saw, cleaned and clean-room packed in a gel-box. They can be easily lift off the gel substrate with flat tipped tweezers.
The Nano-Tec ultra-flat silicon wafers are available as:

Specifications of the Nano-Tec ultra-flat <P/100> silicon wafers and ultra-flat silicon chips

Parameter

Ø4”/100mm wafer

Ø6”/150mm wafer

5x5mm chips

5x5mm chips with thermal SiO2

Product #

10-008141

10-008161

10-008150

10-008155

Orientation

<100>

Type

P (Boron) with one flats

Resistivity

1-10 Ohm/cm

Grade

Prime / CZ Virgin

Coating

None, native oxide only

Thermal SiO2

Thickness

525µm (+/- 20µm)

675µm (+/- 20µm)

Diameter

100mm

150mm

150mm

150mm

Chip size

n.a.

n.a

5x5mm

5x5mm

Chips quantity

n.a.

n.a.

25

25

TTV

≤1.5µm

Bow

≤30µm

Warp

≤30µm

Primary flat

 32.5 +/- 2.5mm

57.5 +/- 2.5mm

Surface roughness

Typically 0.2- 0.3nm, polished one side



Ordering Information for Silicon Wafers & Chips

*Prices without VAT, but within the EU, we have to check for valid VAT-ID.
  
Micro-Tec P{100} silicon wafer Ø2inch/51mm, 275µm thickness Micro-Tec P{100} silicon wafer Ø2inch/51mm, 275µm thickness
Product # Unit Price* Add to Quote / Order
10-008120 each €28,50
Quantity discount: 10 or more: €26,50 each
Qty:

 

Micro-Tec P{100} silicon wafer, Ø4 inch/100mm, 525µm thickness Micro-Tec P{100} silicon wafer, Ø4 inch/100mm, 525µm thickness
Product # Unit Price* Add to Quote / Order
10-008140 each €42,50
Quantity discount: 10 or more: €41,00 each
Qty:

 

Micro-Tec P{100} silicon wafer, Ø6inch/150mm, 675µm thickness Micro-Tec P{100} silicon wafer, Ø6inch/150mm, 675µm thickness
Product # Unit Price* Add to Quote / Order
10-008160 each €59,85
Quantity discount: 10 or more: €57,20 each
Qty:

 

Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 5x5mm chips, 525µm thickness ~270 chips Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 5x5mm chips, 525µm thickness ~270 chips
Product # Unit Price* Add to Quote / Order
10-008145 each €99,50
Qty:

 

Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 7.5x7.5mm chips, 525µm thickness ~112 chips Micro-Tec diced P{100} silicon wafer Ø 4inch / 100mm, diced in 7.5x7.5mm chips, 525µm thickness ~112 chips
Product # Unit Price* Add to Quote / Order
10-008147 each €99,50
Qty:

 

Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10x10mm chips, 525µm thickness ~ 55 Chips Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10x10mm chips, 525µm thickness ~ 55 Chips
Product # Unit Price* Add to Quote / Order
10-008149 each €99,50
Qty:

 

Ordering Information for Ultra-flat Silicon Wafers & Chips

*Prices without VAT, but within the EU, we have to check for valid VAT-ID.
  
Nano-Tec ultra-flat P{100} silicon wafer, Ø4inch/100mm, 525µm thickness Nano-Tec ultra-flat P{100} silicon wafer, Ø4inch/100mm, 525µm thickness
Product # Unit Price* Add to Quote / Order
10-008141 each €97,50
Qty:

 

Nano-Tec ultra-flat P{100} silicon wafer, Ø6inch/150mm, 675µm thickness Nano-Tec ultra-flat P{100} silicon wafer, Ø6inch/150mm, 675µm thickness
Product # Unit Price* Add to Quote / Order
10-008161 each €132,50
Qty:

 

Nano-Tec ultra-flat P{100}silicon chips, 5x5mm, 25 in gel pack, 675µm thickness Nano-Tec ultra-flat P{100}silicon chips, 5x5mm, 25 in gel pack, 675µm thickness
Product # Unit Price* Add to Quote / Order
10-008150 pkg/25 €152,50
Qty:

 

Ordering Information for Thermal SiO2 Chips

*Prices without VAT, but within the EU, we have to check for valid VAT-ID.
  
Nano-Tec ultra-flat P{100} stealth diced silicon chips with 200nm thermal SiO2, 5x5mm, 25 each in gel pack, 675µm thickness Nano-Tec ultra-flat P{100} stealth diced silicon chips with 200nm thermal SiO2, 5x5mm, 25 each in gel pack, 675µm thickness
Product # Unit Price* Add to Quote / Order
10-008155 pkg/25 €169,50
Qty:

 



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